Production method for electronic chip component

ABSTRACT

A production method for an electronic chip component includes the steps of forming a first paste layer by applying paste onto a first end surface of an electronic component body with a second end surface being stuck onto a substrate having an adhesive surface and drying the paste, turning the electronic component body 180 degrees so as to stick the first end surface of the electronic component body onto the substrate by sliding a slider relative to the substrate in a state in which the slider is in contact with the first end surface of the electronic component body, forming a second paste layer by applying the paste onto the second end surface of the electronic component body and drying the paste, and firing the first and second paste layers.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a production method for an electronicchip component, and more particularly, to a production method for anelectronic chip component in which a functional member, such as anexternal electrode, formed of paste, is provided on each end surface ofa component body.

2. Description of the Related Art

In recent years, multiple electronic chip components have been used invarious electronic devices. A specific example of an electronic chipcomponent is a monolithic ceramic capacitor. In general, a monolithicceramic capacitor includes a ceramic body having a substantiallyrectangular parallelepiped shape and incorporating first and secondinternal electrodes that oppose each other, and first and secondexternal electrodes provided on end surfaces of the ceramic body.

In such a monolithic ceramic capacitor, the first and second externalelectrodes are formed by applying a conductive paste onto the endsurfaces of the ceramic body and firing the conductive paste. Forexample, Japanese Unexamined Patent Application Publication No.2007-266208 discloses the following method as a method for forming thefirst and second external electrodes.

First, as shown in FIG. 14A, one end surface of a ceramic body 103 isstuck to a plate 100 including a base plate 101 formed of stainlesssteel and an adhesive silicon rubber 102. Next, as shown in FIG. 14B,the other end surface of the ceramic body 103 is pressed against anapplication head 104, thereby forming a conductive paste layer 105 onthe other end surface of the ceramic body 103, as shown in FIG. 14C. Theconductive paste layer 105 is then fired to form a first externalelectrode 106 shown in FIG. 15A.

Next, as shown in FIG. 15B, the first external electrode 106 is pressedagainst a sheet 107 formed by a PET film 108 coated with a foamable andreleasable adhesive 109. The adhesive force of the foamable andreleasable adhesive 109 is higher than that of the silicon rubber 102.Thus, as shown in FIG. 15C, the ceramic body 103 is released from theplate 100 and is stuck to the sheet 107. By forming a conductive pastelayer on the one end surface of the ceramic body 103 and firing theconductive paste layer in this state, a second external electrode isformed.

This publication describes that the above-described method can produceelectronic chip components with a high working efficiency and a highproduction yield.

However, in the production method for the electronic chip componentdescribed in the publication, a plurality of holding jigs, namely, theplate 100 and the sheet 107, are necessary. Moreover, the relativelyweak adhesive force of the silicon rubber 102 decreases with time, andthe ceramic body 103 may thereby fall off the plate 100. In addition,when the ceramic body 103 is delivered between the different holdingjigs, it may fall off or may be left on the plate 100. Hence, it isdifficult to achieve a sufficiently high production yield.

SUMMARY OF THE INVENTION

Accordingly, preferred embodiments of the present invention provide aproduction method for an electronic chip component that can easilyproduce electronic chip components with a high production yield.

According to a preferred embodiment of the present invention, aproduction method for an electronic chip component including anelectronic component body having a substantially rectangularparallelepiped shape and first and second functional members formed ofpaste is provided. The electronic component body includes first andsecond main surfaces, first and second side surfaces perpendicular orsubstantially perpendicular to the first and second main surfaces, andfirst and second end surfaces perpendicular or substantiallyperpendicular to the first and second main surfaces and the first andsecond side surfaces. The first and second functional members arerespectively provided on the first and second end surfaces of theelectronic component body.

The production method according to a preferred embodiment of the presentinvention includes a sticking step of sticking the second end surface ofthe electronic component body onto a substrate having an adhesivesurface, a step of forming a first paste layer by applying the pasteonto the first end surface of the electronic component body stuck to thesubstrate and drying the paste, a step of turning the electroniccomponent body 180 degrees so as to stick the first end surface of theelectronic component body with the first paste layer onto the substrateby sliding a slider relative to the substrate in a state in which theslider is in contact with the first end surface of the electroniccomponent body, a step of forming a second paste layer by applying thepaste onto the second end surface of the electronic component body anddrying the paste, and a step of forming the first and second functionalmembers by firing the first and second paste layers.

The sticking step may include the steps of sticking the first mainsurface of the electronic component body onto the surface of thesubstrate, and turning the electronic component body 90 degrees so as tostick the second end surface of the electronic component body onto thesubstrate by sliding the slider relative to the substrate in a state inwhich the slider is in contact with the second main surface of theelectronic component body.

Preferably, the paste is a ceramic paste, for example.

Preferably, the paste is a conductive paste, and the first and secondfunctional members are first and second external electrodes. In thiscase, it is possible to easily produce electronic ceramic chipcomponents with a high production yield.

Preferably, the electronic component body is a ceramic body in which afirst internal electrode connected to the first external electrode and asecond internal electrode connected to the second external electrodeface each other.

Preferably, a surface of the slider facing the first end surface haselasticity. This structure allows the electronic component body to beeasily turned with high reliability. Further, this structure caneffectively prevent the electronic component body from being damaged bycontact with the slider.

Preferably, the slider includes a support member and an elastic memberstuck onto a surface of the support member. This structure allows thesurface of the slider to be kept flat. It is therefore possible toeasily turn the electronic component body with high reliability. Inaddition, handlability of the slider can be improved.

Preferably, the support member is formed by a metal plate, for example.

Preferably, a surface of the slider facing the first end surface hasirregularities. This structure allows the electronic component body tobe easily turned with high reliability.

In the production method for the electronic chip component according toa preferred embodiment of the present invention, the electroniccomponent body is turned by sliding the slider relative to the substratein a state in which the slider is in contact with the first end surfaceof the electronic component body, thereby exposing the second endsurface. Since it is unnecessary to use a plurality of holding jigs andto deliver the electronic component body between the different holdingjigs, the electronic component body can be effectively prevented fromfalling off. This allows electronic chip components to be easilyproduced with high production yield.

Other features, elements, steps, characteristics and advantages of thepresent invention will become more apparent from the following detaileddescription of preferred embodiments of the present invention withreference to the attached drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a flowchart showing a production procedure for a ceramicelectronic component.

FIG. 2 is a schematic perspective view showing a step of placing greenceramic laminates on a substrate.

FIG. 3 is a cross-sectional view taken along line III-III of FIG. 2.

FIG. 4 is a schematic sectional view illustrating a step of turning agreen ceramic laminate 90 degrees.

FIG. 5 is a schematic sectional view illustrating a step of turning thegreen ceramic laminate 90 degrees.

FIG. 6 is a schematic sectional view illustrating a step of forming afirst conductive paste layer.

FIG. 7 is a schematic sectional view illustrating a step of turning thegreen ceramic laminate 180 degrees.

FIG. 8 is a schematic sectional view illustrating a step of turning thegreen ceramic laminate 180 degrees.

FIG. 9 is a schematic sectional view illustrating a step of turning thegreen ceramic laminate 180 degrees.

FIG. 10 is a schematic sectional view illustrating a step of forming asecond conductive paste layer.

FIG. 11 is a schematic perspective view of an electronic chip component.

FIG. 12 is a cross-sectional view taken along line XI-XI of FIG. 11.

FIG. 13 is a cross-sectional view taken along line XII-XII of FIG. 11.

FIGS. 14A to 14C are schematic sectional views illustrating steps ofproducing an electronic chip component in the related art.

FIGS. 15A to 15C are schematic sectional views illustrating steps ofproducing the electronic chip component in the related art.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

The present invention will be clearly explained below by describingpreferred embodiments thereof with reference to the drawings.

In a preferred embodiment of the present invention, a production methodfor a ceramic electronic component serving as an electronic chipcomponent will be described as an example. First, a ceramic electroniccomponent 1 to be produced in the present preferred embodiment will bedescribed with reference to FIGS. 11 to 13.

For example, the ceramic electronic component 1 defines a ceramiccapacitor device, a ceramic piezoelectric device, thermistor device, oran inductor device. Referring to FIGS. 11 to 13, the ceramic electroniccomponent 1 includes a ceramic body 10 preferably having a substantiallyrectangular parallelepiped shape. More specifically, the ceramic body 10preferably has a substantially rectangular parallelepiped shapeincluding chamfered corner and edge portions. The ceramic body 10includes first and second main surfaces 10 a and 10 b, first and secondside surfaces 10 c and 10 d, and first and second end surfaces 10 e and10 f. The first and second side surfaces 10 c and 10 d are perpendicularor substantially perpendicular to the first and second main surfaces 10a and 10 b. The first and second end surfaces 10 e and 10 f areperpendicular or substantially perpendicular to the first and secondmain surfaces 10 a and 10 b and the first and second side surfaces 10 cand 10 d.

The size of the ceramic body 10 is not limited particularly.

The ceramic body 10 is formed of an appropriate ceramic material. Theceramic material that forms the ceramic body 10 is appropriatelyselected in accordance with the characteristics of the ceramicelectronic component 1. For example, when the ceramic electroniccomponent 1 is a ceramic capacitor device, the ceramic body 10 can beformed of a material mainly containing a dielectric ceramic material.Examples of dielectric ceramic materials are BaTiO₃, CaTiO₃, SrTiO₃, andCaZrO₃, for example. Accessory ingredients, such as a Mn compound, a Fecompound, a Cr compound, a Co compound, and a Ni compound, may beappropriately added to the ceramic body 10.

When the ceramic electronic component is a ceramic piezoelectric device,the ceramic body 10 can be formed of a material mainly containing apiezoelectric ceramic material. A specific example of a piezoelectricceramic material is a PZT (lead zirconate titanate) ceramic material.

When the ceramic electronic component 1 is a thermistor device, theceramic body 10 can be formed of a material mainly containing asemiconductor ceramic material. A specific example of a semiconductorceramic material is a spinel ceramic material.

When the ceramic electronic component 1 is an inductor device, theceramic body 10 can be formed of a material mainly containing a magneticceramic material. A specific example of a magnetic ceramic material is aferrite ceramic material.

For example, the ceramic body 10 may be formed by a plurality of stackedceramic layers, or may be formed by an integral ceramic body. Thestructure of the ceramic body 10 can be appropriately selected, forexample, in accordance with the production method for the ceramic body10.

As shown in FIGS. 12 and 13, a plurality of first internal electrodes 11and a plurality of second internal electrodes 12 are provided in theceramic body 10. The first and second internal electrodes 11 and 12 arealternately arranged to be spaced apart from each other. In other words,the first and second internal electrodes 11 and 12 are arranged suchthat portions of the adjacent first and second internal electrodes 11and 12 face each other with the ceramic layer being disposedtherebetween.

The first and second internal electrodes 11 and 12 can be formed of anappropriate conductive material. More specifically, for example, thefirst and second internal electrodes 11 and 12 can be formed of metalsuch as Ni, Cu, Ag, Pd, or Au, or an alloy containing at least one ofthese metals, for example, an alloy of Ag and Pd, for example.

As shown in FIG. 11, a first external electrode 15 connected to thefirst internal electrodes 11 is provided on the first end surface 10 eof the ceramic body 10. Further, a second external electrode 16connected to the second internal electrodes 12 is provided on the secondend surface 10 f of the ceramic body 10.

The first and second external electrodes 15 and 16 can be formed of anappropriate conductive material. For example, the first and secondexternal electrodes 15 and 16 can be formed of metal such as Ni, Cu, Ag,Pd, or Au, or an alloy containing at least one of these metals, forexample, an alloy of Ag and Pd, for example.

In the present preferred embodiment, the first and second externalelectrodes 15 and 16 are formed of a conductive paste containing theabove-described conductive material.

Next, a production method for the ceramic electronic component 1 will bedescribed.

Referring to FIG. 1, first, a green ceramic laminate is formed in StepS1. More specifically, a conductive paste for forming internalelectrodes is printed in a predetermined pattern on a ceramic greensheet by screen printing or by other methods, thereby forming aninternal electrode pattern. Next, the ceramic green sheet on which theinternal electrode pattern is formed and a ceramic green sheet on whichan internal electrode pattern is not formed are stacked to form a motherlaminate. Then, the mother laminate is cut into green ceramic laminates30 shown in FIG. 2. In a later firing step, ceramic bodies 10 are formedfrom the green ceramic laminates 30. Further, first and second internalelectrodes 11 and 12 are formed from the internal electrode pattern. Inthe present preferred embodiment, an electronic component body is ageneral term of a green ceramic laminate 30 and a ceramic body 10.

Next, in Step S2, a plurality of green ceramic laminates 30 are placedon a surface 20 a of a substrate 20, as shown in FIGS. 2 and 3. Thesurface 20 a of the substrate 20 has an adhesive force. Morespecifically, as shown in FIG. 3, the substrate 20 includes a substratebody 21, and an adhesive elastic layer 22 provided on a surface of thesubstrate body 21. In Step S2, a first main surface 30 a of the ceramiclaminate 30 is stuck onto the adhesive elastic layer 22.

Next, in Step S3, the green ceramic laminate 30 is turned 90 degrees.More specifically, as shown in FIG. 4, a slider 23 is brought intopressing contact with a second main surface 30 b of the green ceramiclaminate 30. In this state, the slider 23 is slid relative to thesubstrate 20, whereby the green ceramic laminate 30 is turned 90degrees. As a result, a second end surface 30 f of the green ceramiclaminate 30 is stuck onto the surface 20 a of the substrate 20. In thepresent preferred embodiment, Steps S1 to S3 described above constitutea sticking step of sticking the second end surface 30 f of the greenceramic laminate 30 onto the substrate 20.

In the present preferred embodiment, a surface 23 a of the slider 23facing the green ceramic laminate 30 has elasticity. More specifically,as shown in FIG. 4, the slider 23 includes a hard support member 24formed by a metal plate, and an elastic member 25 stuck to the supportmember 24 and formed of rubber or resin. Since the elastic member 25 islocated on the side of the surface 23 a in this way, the green ceramiclaminate 30 is effectively prevented from being damaged by contact withthe slider 23. Further, since the support member 24 is provided, thesurface 23 a of the slider 23 facing the green ceramic laminate 30 canbe kept flat. Moreover, handlability of the slider 23 is improved by thesupport member 24.

In this specification, the term “elastic member” refers to a memberhaving rubber elasticity, that is, a member that has elasticity and iseasy to elastically deform. The elastic member does not include metal.

The structure of the slider 23 is not particularly limited to theabove-described structure. For example, the slider 23 may be formed by afilm material having an adhesive layer on its surface.

In the present preferred embodiment, the surface 23 a of the slider 23facing the green ceramic laminate 30 has fine irregularities to increasethe coefficient of friction thereof. This allows the green ceramiclaminate 30 to be turned reliably. Of course, the surface 23 a of theslider 23 does not always need to have irregularities.

The method of forming irregularities is not particularly limited. Forexample, irregularities may be physically formed by sand blasting orchemically formed by etching, for example. Alternatively, irregularitiesmay be formed on the surface of the slider 23 by pouring a material ofthe slider 23, such as resin or rubber, into a mold havingirregularities on its surface.

Next, in Step S4, as shown in FIG. 6, a conductive paste is applied ontoa first end surface 30 e of the green ceramic laminate 30, and is driedto form a first conductive paste layer 31. The method of applying theconductive paste is not particularly limited. For example, theconductive paste may be applied by dipping, screen printing, an inkjetmethod, a method of dripping conductive paste, or a method of sticking asheet of conductive paste.

Next, in Step S5, as shown in FIGS. 7 to 9, the green ceramic laminate30 is turned 180 degrees. Specifically, as shown in FIG. 7, the slider23 is brought into pressing contact with the first end surface 30 e ofthe green ceramic laminate 30. More specifically, the slider 23 isbrought into pressing contact with the first conductive paste layer 31provided on the first end surface 30 e. In this state, the slider 23 isslid relative to the substrate 20, whereby the green ceramic laminate 30is turned 180 degrees, as shown in FIGS. 8 and 9. As a result, the firstconductive paste layer 31 on the first end surface 30 e of the greenceramic laminate 30 is stuck onto the surface 20 a of the substrate 20.

Next, in Step S6, as shown in FIG. 10, a conductive paste is appliedonto the second end surface 30 f of the green ceramic laminate 30, andis dried to form a second conductive paste layer 32. The method ofapplying the conductive paste is not particularly limited. For example,the conductive paste may be applied by dipping, screen printing, aninkjet method, a method of dripping conductive paste, or a method ofsticking a sheet of conductive paste, for example.

Then, by firing the green ceramic laminate 30 and the first and secondconductive paste layers 31 and 32 in Step S7, a ceramic electroniccomponent 1 including the ceramic body 10, the first and second internalelectrodes 11 and 12, and the first and second external electrodes 15and 16 can be produced. The firing temperature can be appropriately setin accordance with the ceramic material and the conductive paste to beused.

As described above, the orientation of the green ceramic laminate 30 ischanged by turning the green ceramic laminate 30 on the substrate 20 bythe slider 23 in the present preferred embodiment. For this reason, theceramic electronic component 1 can be produced without using a pluralityof supporting jigs and without delivering the green ceramic laminate 30between the supporting jigs. This effectively prevents the green ceramiclaminate 30 from falling off. Moreover, a plurality of adhesives areunnecessary. Hence, it is unnecessary to manage the adhesive forces of aplurality of adhesives, and electronic chip components can be easilyproduced with a high production yield.

In the above-described preferred embodiment, the production method forthe ceramic electronic component has been described as an example of aproduction method for an electronic chip component. However, theproduction method for the electronic chip component according to thepresent invention is not limited to the production method for theceramic electronic component. The production method according to thepresent invention is also preferably applied to production of electronicchip components in each of which a functional member is provided on eachend surface of an electronic component body, for example, to productionof a multiterminal capacitor.

For example, the first and second functional members may be ceramicmembers, instead of the external electrodes. In this case, the first andsecond functional members are formed of ceramic paste.

While the green ceramic laminate 30 and the first and second conductivepaste layers 31 and 32 are simultaneously fired in the preferredembodiment, the green ceramic laminate 30 may be first fired, and thefirst and second conductive paste layers 31 and 32 may be formed on thefired ceramic laminate 30.

While preferred embodiments of the present invention have been describedabove, it is to be understood that variations and modifications will beapparent to those skilled in the art without departing from the scopeand spirit of the present invention. The scope of the present invention,therefore, is to be determined solely by the following claims.

What is claimed is:
 1. A production method for an electronic chipcomponent including an electronic component body including first andsecond functional members, first and second main surfaces, first andsecond side surfaces arranged perpendicular or substantiallyperpendicular to the first and second main surfaces, and first andsecond end surfaces arranged perpendicular or substantiallyperpendicular to the first and second main surfaces and the first andsecond side surfaces, the first and second functional members beingrespectively provided on the first and second end surfaces of theelectronic component body, the production method comprising the stepsof: positioning the electronic component body such that at least one ofthe first and second main surfaces, the first and second side surfaces,and the first and second end surfaces of the electronic component bodycontacts a substrate by sliding a slider relative to the substrate in astate in which the slider is in contact with at least another one of thefirst and second main surfaces, the first and second side surfaces, andthe first and second end surfaces of the electronic component body; andapplying the first functional member to at least a surface opposite tothe at least one of the first and second main surfaces, the first andsecond side surfaces, and the first and second end surfaces of theelectronic component body which contacts the substrate; wherein thepositioning step includes a step of turning the electronic componentbody such that the at least another one of the first and second mainsurfaces, the first and second side surfaces, and the first and secondend surfaces of the electronic component body contacts the substrate. 2.The production method according to claim 1, wherein the positioning stepincludes a step of turning the electronic component body by an angle of90 degrees or 180 degrees.
 3. The production method according to claim1, wherein the applying step includes a step of attaching a sheet to atleast the surface opposite to the at least one of the first and secondmain surfaces, the first and second side surfaces, and the first andsecond end surfaces of the electronic component body which contacts thesubstrate.
 4. The production method according to claim 3, wherein thesheet is a conductive material.
 5. The production method according toclaim 3, wherein the sheet is a ceramic material.
 6. The productionmethod according to claim 1, wherein the applying step includes a stepof spreading a paste onto at least the surface opposite to the at leastone of the first and second main surfaces, the first and second sidesurfaces, and the first and second end surfaces of the electroniccomponent body which contacts the substrate.
 7. The production methodaccording to claim 6, wherein the paste is a conductive paste.
 8. Theproduction method according to claim 6, wherein the paste is a ceramicpaste.
 9. The production method according to claim 1, wherein thesubstrate includes a sticky elastic layer.
 10. The production methodaccording to claim 1, further comprising the steps of: turning theelectronic component body such that at least the surface opposite to theat least one of the first and second main surfaces, the first and secondside surfaces, and the first and second end surfaces of the electroniccomponent body which contacts the substrate on which the paste isapplied contacts the substrate by sliding the slider relative to thesubstrate in a state in which the slider is in contact with the at leastanother one of the first and second main surfaces, the first and secondside surfaces, and the first and second end surfaces of the electroniccomponent body; and applying the second functional member to at leastthe at least one of the first and second main surfaces, the first andsecond side surfaces, and the first and second end surfaces of theelectronic component body which contacts the substrate.